A Significant Role of Rotating Magnetic on Sn-Cu Based Lead Free Solder Alloys for Electronic Applications

Document Type : Original Article

Authors

1 High Institutes for Engineering &Technology- Obour. Km 21Cairo\ Belbies Rd.,Egypt

2 Assistant Professor of material science and nanotechnology, Basic science Department, Bilbeis Higher Institute of Engineering, Egypt

Abstract

Due to the dangerous health effects of lead many candidates  lead free solder alloys are developed for many welding applications. Sn-0.7Cu based alloys one of the most candidates for electronic applications this may be for the melting temperature and the low cost in this paper rotating magnetic field of 0.5T used with addition of (.05 co wt% ) and (.5 co wt%) where the mechanical testes show strength improvement between 32-44 Mpa the tensile properties have been tested at different temperatures and different strain rate, X-ray diffraction(XRD) , optical microscope  were employed to analyze the microstructure of Sn -0.7 Cu-.05 Co wt% and Sn -0.7cu -0.5Co Wt% before and after applying the rotating magnetic field(RMF), respectively and the phases were identified by energy-dispersive spectroscopy (EDS) and Differential scanning calorimetry (DSC) was used to investigate the melting temperature of which rang from 230-233 0c. 

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